Mid-Fill Woven Wire Mesh Pattern

The S-70 architectural wire mesh pattern demonstrates Banker's exclusive embossing technology. Completely cold-formed during the crimping process, the material constantly transitions from round, glossy surfaces to highly faceted satin surfaces.  This heavy and dense wire mesh pattern will be noticed in your next project design.

Pattern Details

Percent Open:55.2%

Overall Thickness:.24

Crimp Style: E1E1

Aspect Ratio: 1.00:1

Opening Limitation: .346

Weight: 2.08 lbs./sq. ft.

Available Raw Materials:
stainless materialplain-steel material
Click here for more information on Raw Materials Available Secondary Finishes:
PlatedPowder Coat
Click here for more information on Secondary Finishes
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